Ideal for machining of complex workpiece geometries in hard and brittle advanced materials like e. g. ceramics, glass, corundum, carbide or composites
Up to 50% lower process forces due to ULTRASONIC
Up to 40 % less sub-surface damage (SSD)
Up to 3 times higher productivity
Surface quality to Ra ≤ 0.1 µm is possible
Integration via HSK interface. All standard machine features for milling / turning are possible.
Workpieces
Mirror support
Zerodur
Optical industry
ø 400 × 150 mm
Wafer chuck
SiC
Semiconductor
ø 300 × 6 mm
Blades
Composite (CMC)
Aerospace
50 × 150 × 195 mm
Indexable insert
Carbide
Tooling
15 × 20 × 8 mm
Facts
Actuator system of the latest generation with amplitudes down to ≤ 5 µm
Flexible configuration
ULTRASONIC drilling
ULTRASONIC-grinding of ceramics, glass etc.
ULTRASONIC 3rd Generation – optimal processes due to intelligent control
Automatic frequency detection and tracking ULTRASONIC complete (as standard)
Individual optimisation of machining strategies by amplitude regulation (ULTRASONIC programming cycle) or automatic feed adaptation (ULTRASONIC feed control option).
ULTRASONIC microDRILL
Adaptive spindle with max. 32,000 rpm
Use of hollow- or spiral-drills starting from ø 0.1 mm
Automatic drilling force regulation (<1 N)
ICS with up to 40 bar and volume flow monitoring
Automatic ejector for drill cores (with hollow drills) to avoid tool breakage
ULTRASONIC axialGRINDING
Highly efficient grinding of rotationally symmetrical structures in hard and brittle materials in combination with direct drive C-axis (option)
ULTRASONIC microSCOPE
Camera-based workpiece alignment and detection of hidden contours or marks in transparent material, e. g. aligning a glass cylinder with two marks, ideal for the semiconductor and optical industries.