Integrated processes
Reduced process forces for very high productivity
Highly efficient grinding of rotationally symmetrical structures in hard and brittle materials in combination with direct drive C-axis (option)
Camera-based workpiece alignment and detection of hidden contours or marks in transparent material, e. g. aligning a glass cylinder with two marks, ideal for the semiconductor and optical industries.
Turning on 5-axis milling machines
6-sided complete machining by turning and milling
Grinding for surface finishes with Ra up to 0.1 µm
External & internal gear cutting up to ø 3,200 mm and gear quality > 5
Reduced process forces for very high productivity
Contact-free 5-axis laser machining
Milling, Turning and Additive Manufacturing on
Higher process stability and reliability due to process monitoring & control